Intellectual Property Law

US Patent 7476982 - Electrically conductive nanofiber adhesive

This patent from the Regents of the University of California teaches a potential replacement for solder based IC connection in the form of nanofibers that could help eliminate problems of thermal mismatch during packaging which result in integrated circuit malfunction. Claim 1 reads:

1. An integrated circuit chip comprising:

a chip surface;

one or more contact pads disposed on the chip surface; and

one or more electrically conductive nano-fibers formed on the one or more contact pads, the one or more electrically conductive nano-fibers configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.

Full post as published by TinytechIP on January 16, 2009 (boomark / email).