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Intellectual Property Law
: TinytechIPUS Patent 7615776 - Self-assembled nanowire circuitry
This patent from IBM teaches the fabrication of logic circuits which uses fewer masking steps by including self-assembly of vertical nanowires to form channels of the circuitry. Claim 1 reads:
1. A circuit comprising: a first metal layer on a substrate; an insulating layer on said first metal layer; a second metal layer on said insulating layer; a self-assembled first semi-conductivity type material on one side of said first metal layer; a self-assembled second semi-conductivity type material on the other side of said first metal layer; and a self-assembled nanowire extending between a field concentrator on said first metal layer and one of said first semi-conductivity type material and said second semi-conductivity type material to form said self-assembled connection.
Full post as published by TinytechIP on November 12, 2009 (boomark / email).
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