Intellectual Property Law

US Patent 7781260 - Nanocoatings for improved adhesion in microelectronics packaging

This patent from Intel teaches using nanoparticle films to improve adhesion between interconnects and epoxy in electronics packaging. Claim 1 reads:

1. A method comprising:

coating an interconnect structure disposed on a die with at least one of a layer of functionalized nanoparticles and nanowires, wherein the functionalized nanoparticles are dispersed in a solvent;

heating the layer comprising at least one of a layer of functionalized nanoparticles and nanowires, to drive off a portion of the solvent; and

applying an underfill on the coated interconnect structure.

Full post as published by TinytechIP on August 26, 2010 (boomark / email).